| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board that connects semiconductor chips and enables decoupling capacitor connection with high reliability. <P>SOLUTION: This method is for manufacturing a wiring board 300 composed of electrode layers 102 and 104 opposed with a dielectric layer 103 between both layers, a capacitor connected to a semiconductor chip, via wiring 108 connected to the semiconductor chip through an electrode layer 102, and pattern wiring 208 connected to the via wiring. This method comprises a process for forming an electrode layer with a through hole which the via wiring passes through and a dielectric layer to build a capacitor, a process for mounting the capacitor in a way that it corresponds to a pattern wiring with an insulating layer 106 interposed, and a process for forming a via hole that reaches a pattern wiring via the through-hole to build a via wiring. In addition, this method manufactures the wiring board in a way that the via hole is formed in the insulated layer using the electrode layer as the mask. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
