发明名称 CIRCUIT STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electric connection box in which densification can be realized by laying a second bus bar coated with an insulating film on a first bus bar or a control circuit board structure, thereby increasing the degree of freedom in design of conduction path and wiring a large number of conduction paths in a limited space. <P>SOLUTION: A branch portion 12 and a power supply distributing portion 13 are combined entirely into substantially L-shape while butting the edges each other to produce a circuit body 11 which is then surrounded by a casing 15 thus obtaining an electric connection box 10. A second bus bar 35 is wired in the power supply distributing portion 13. An insulating film is formed on the surface of the second bus bar by so-called power painting where insulating powder of mica or silicon (Si) is sprayed to the surface of the second bus bar. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006187122(A) 申请公布日期 2006.07.13
申请号 JP20040378325 申请日期 2004.12.27
申请人 AUTO NETWORK GIJUTSU KENKYUSHO:KK;SUMITOMO WIRING SYST LTD;SUMITOMO ELECTRIC IND LTD 发明人 YAMASHITA HISANOBU
分类号 H02G3/16;H01R11/01;H05K7/06 主分类号 H02G3/16
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