发明名称 PLATING APPARATUS AND PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To simplify the control of an anode to reduce a production cost, and to improve a circulating property of a plating liquid to increase a treatment speed. SOLUTION: The plating apparatus comprises: a fixed drum 20 having an anode 21 on its outer surface exposed outward; a rotation drum which is arranged on a circumference of the fixed drum and feeds a workpiece W in a longitudinal direction while winding the workpiece around itself; an annular opening 35 which is formed in the bottom of the rotation drum, is continuous in a circumferential direction of the rotation drum and penetrates from the outer surface to the inner surface of the rotation drum; a plating-liquid-feeding path 22 that penetrates inside the fixed drum and opens at such a position on the outer surface of the fixed drum as to correspond to a position 52a in a predetermined winding angle range of the rotation drum; a tunnel-shaped space 52 for a liquid channel, which is surrounded by the workpiece wound around the outer surface of the rotation drum, a peripheral wall of the annular opening and the outer surface of the fixed drum; and a plating-liquid-feeding system for feeding the plating liquid to the liquid channel. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006183085(A) 申请公布日期 2006.07.13
申请号 JP20040376955 申请日期 2004.12.27
申请人 DOWA MINING CO LTD 发明人 MIYAZAWA HIROSHI;INAO TERUMASA
分类号 C25D5/02;C25D17/08 主分类号 C25D5/02
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