发明名称 |
Method to manufacture a universal footprint for a package with exposed chip |
摘要 |
A semiconductor die package is disclosed. It may include a semiconductor die having a first surface and a second surface, and a leadframe structure. A molding material may be formed around at least a portion of the die and at least a portion of the leadframe structure. A solderable layer may be on the exterior surface of the molding material and the first surface of the semiconductor die.
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申请公布号 |
US2006151861(A1) |
申请公布日期 |
2006.07.13 |
申请号 |
US20050035918 |
申请日期 |
2005.01.13 |
申请人 |
NOQUIL JONATHAN A;TANGPUZ CONNIE;MANATAD ROMEL;MARTIN STEPHEN;JOSHI RAJEEV;IYER VENKAT |
发明人 |
NOQUIL JONATHAN A.;TANGPUZ CONNIE;MANATAD ROMEL;MARTIN STEPHEN;JOSHI RAJEEV;IYER VENKAT |
分类号 |
H01L23/495 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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