发明名称 SILICON PACKAGING FOR OPTO-ELECTRONIC MODULES
摘要 <p>An opto-electronic apparatus comprising a base layer, one or more photonic elements positioned on the base layer, and an optical layer suspended over the base layer, the optical layer including a moveable optical element positioned over at least one of the photonic elements. A process comprising forming a base layer, placing one or more photonic elements on the base layer, and suspending an optical layer over the photonic elements on the base layer, the optical layer including a moveable optical element.</p>
申请公布号 WO2006074048(A2) 申请公布日期 2006.07.13
申请号 WO2005US47380 申请日期 2005.12.23
申请人 INTEL CORPORATION;EPITAUX, MARC 发明人 EPITAUX, MARC
分类号 G02B26/08;G02B6/42;G02B7/02 主分类号 G02B26/08
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