发明名称 |
DIRECT ALIGNER AND DIRECT EXPOSURE METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a direct aligner and direct exposure method which can control light irradiation on an objective substrate at desired illumination distribution, and can obtain target illumination distribution easily even if exposure condition is changed. <P>SOLUTION: The direct aligner 1 having a light source 2 which illuminates the objective substrate 3 comprises a measuring means 11 which measures illumination distribution of light at a position corresponding to an exposed surface of the objective substrate 3, and a controlling means 12 which controls the light source 2 on the basis of the result measured by the measuring means 11 so that target illumination distribution can be obtained. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006186291(A) |
申请公布日期 |
2006.07.13 |
申请号 |
JP20050048945 |
申请日期 |
2005.02.24 |
申请人 |
SHINKO ELECTRIC IND CO LTD |
发明人 |
SEKIKAWA KAZUNARI;MITSUMIZU HIROAKI;INOUE TAKAHIRO |
分类号 |
H01L21/027;G03F7/20;H05K3/00 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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