| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method by which a heat conductive member, that is installed between a heat emission member (object requiring heat to be dissipated) such as an electronic part and a heat dissipating structure, sticks fast and is easy to handle, is produced reliably with a simple process and a heat dissipating structure using the member. <P>SOLUTION: The manufacturing method of the heat conductive member comprises forming an uncured silicone body by laminating, on the substrate, a heat conductive silicone composition containing (a) an organopolysiloxane having at least two alkenyl groups in the molecule, (b) a heat conductive filler, (c) an organohydrogenpolysiloxane having not less than two hydrogen atoms on average directly bonded to a silicon atom in the molecule, (d) a platinum group addition reaction catalyst, and (e) a volatile compound having one Si-H group-addible alkenyl group in the molecule, and thermally curing the uncured silicone body to form a silicone heat conductive body in which a skin-cured layer is created on the outside surface and a low hardness layer less hard than the skin-cured layer is created on the inside surface of the substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
