发明名称 LITHOGRAPHY APPARATUS AND DEVICE MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a lithography apparatus and device manufacturing method that improves handling of regions prone to excess exposed-spot overlap. <P>SOLUTION: The lithography apparatus is provided with an array of individually controllable elements configured to modulate sub-beams of radiation and a data path that includes at least one data manipulation device arranged to at least partly convert data defining a requested pattern to a control signal suitable for controlling the array of individually controllable elements to form substantially the requested pattern on the substrate. The data manipulation device is arranged to carry out the conversion by applying a pseudo-inverted form of a point-spread function matrix to a column vector representing the requested pattern. The point-spread function matrix includes information about the shape and relative position of the point-spread function of each irradiated spot to be exposed on the substrate by one of the sub-beams of radiation at a given time. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006186364(A) 申请公布日期 2006.07.13
申请号 JP20050371835 申请日期 2005.12.26
申请人 ASML NETHERLANDS BV 发明人 TINNEMANS PATRICIUS ALOYSIUS J;BASELMANS JOHANNES JACOBUS MATHEUS;JORRITSMA LAURENTIUS C
分类号 H01L21/027;G02B26/08;G03F7/20 主分类号 H01L21/027
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