发明名称 METHOD FOR FORMING FILM AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a patterning apparatus to be used in patterning processing having a high degree of freedom. SOLUTION: The patterning apparatus has a vacuum chamber adjustable in pressure, a nozzle connected to a material feeding source and also arranged in the vacuum chamber, into which a material from the material feeding source is fed, and a substrate stage arranged in the vacuum chamber for holding and fixing a substrate. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006183143(A) 申请公布日期 2006.07.13
申请号 JP20050343370 申请日期 2005.11.29
申请人 SEIKO EPSON CORP 发明人 MIYAZAWA TAKASHI
分类号 C23C14/12;B05D1/26;B05D7/00;G09F9/00;G09F9/30;H01L27/32;H01L51/50;H05B33/10 主分类号 C23C14/12
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