发明名称 |
Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus |
摘要 |
A method for manufacturing a semiconductor device with a bump electrode wherein the bump electrode includes a resin material as a core and at least a top surface covered with a conductive film. The method includes placing the resin material on a substrate on which an electrode terminal is formed by an inkjet method, and forming an interconnecting metal that connects the electrode terminal to a top surface of the resin material. |
申请公布号 |
US2006154468(A1) |
申请公布日期 |
2006.07.13 |
申请号 |
US20050311800 |
申请日期 |
2005.12.19 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
TANAKA SHUICHI;KURIBAYASHI MITSURU |
分类号 |
H01L21/44 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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