CHIP SCALE PACKAGE HAVING METAL PLATE AND STACK PACKAGE, SEMICONDUCTOR PACKAGE MODULE USING THEREOF,申请号KR20050002140-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	CHIP SCALE PACKAGE HAVING METAL PLATE AND STACK PACKAGE, SEMICONDUCTOR PACKAGE MODULE USING THEREOF
摘要
申请公布号	KR20060081749(A)	申请公布日期	2006.07.13
申请号	KR20050002140	申请日期	2005.01.10
申请人	SAMSUNG ELECTRONICS CO., LTD.	发明人	BAEK, JOONG HYUN;PARK, SANG WOOK;LEE, DONG HO;BAEK, HYUNG GIL;LEE, HAE HYUNG;LEE, HEE JIN
分类号	H01L23/48	主分类号	H01L23/48
代理机构		代理人
主权项
地址

您可能感兴趣的专利

OIL CLEANING DEVICE

METHOD AND APPARATUS FOR FORMING RUBBER-CORD SHELLS

DEVICE FOR HOLES MACHINING

Способ стерилизации инструмента

ICE-RESISTANT PLATFORM

METHOD OF PRODUCING TWISTED FIBRE

METHOD FOR MEASURING DAMAGE OF NONLINEAR OPTICAL CRYSTAL AND DAMAGE RECOVERING DEVICE

REACTOR WATER SAMPLING DEVICE

FLUID PRESSURE COMPRESSOR

GAS TURBINE ROTOR BLADE

ELECTROSTATIC PRECIPITATOR

TIGHTENING PARTS

SUBSTITUTED BENZOIC ACID INTERMEDIATES

SONDENKONTROLLVERFAHREN UND -GERAET FUER EINEN APPARAT MIT MEHREREN FREIHEITSGRADEN.

PROCESS AND EQUIPMENT FOR MICRO-PATTERN FORMING ON ROLL SURFACE

METHOD FOR OBTAINING BACTERIAL CULTURE FOR PRODUCTION OF HEALTH DAIRY FOODS

METHOD FOR SYNTHESIS OF CARBOXYLIC ACID DERIVATIVES

PRODUCTION OF FIBROUS MATERIAL

DEVICE FOR GROWING SINGLE CRYSTALS FROM MELTS