发明名称 SUBSTRATE PROCESSING DEVICE AND ITS CONVEYANCE ALIGNMENT METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate processing device capable of improving the accuracy of height position and effectively performing teaching while reducing the processes by visual check and manual labor of a worker at the time of teaching in comparison with the conventional way, and to provide its conveyance alignment method. <P>SOLUTION: The height difference between the mapping sensor 32 of a conveyance mechanism 30 and a substrate conveyance arm 33 and a substrate conveyance arm 34 is detected by an arm position detection sensor 40. Further, the height position of jigs 38 and 39 for Z-axis teaching is detected by the mapping sensor 32. Moreover, the access height to each part of the substrate conveyance arm 33 and the substrate conveyance arm 34 is calculated on the basis of the height position difference between the jigs 38 and 39 for Z-axis teaching, the mapping sensor 32, the substrate conveyance arm 33 and the substrate conveyance arm 34. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006185960(A) 申请公布日期 2006.07.13
申请号 JP20040374955 申请日期 2004.12.24
申请人 TOKYO ELECTRON LTD 发明人 KONDO KEISUKE
分类号 H01L21/68;H01L21/027 主分类号 H01L21/68
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