发明名称 BONDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a bonding device where an installation space can be made small. SOLUTION: A loader unit 12 is arranged in a side part of a width direction W of a bonding unit 11. A table 33 where a lead frame 2 is set is installed in a bonding zone 23 of the bonding unit 11. The table 33 is constituted so that both-way movement is realized in the width direction W of the bonding device 1 in the bonding zone 23. A work feeding device 41 performing a supply operation for supplying the lead frame 2 supplied from a magazine of a loader unit 12 to a supply standby rail 52 to the table 33 and setting it and a storage operation for moving the lead frame 2 which is set in the table 33 to a collection standby rail 51 and holding it in the magazine of the loader unit 12 is arranged on a right side of the bonding zone 23. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006186113(A) 申请公布日期 2006.07.13
申请号 JP20040378356 申请日期 2004.12.28
申请人 NIDEC TOSOK CORP 发明人 YUKIMORI YOSHIAKI
分类号 H01L21/52 主分类号 H01L21/52
代理机构 代理人
主权项
地址