| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor laser device in which a metallization layer is formed on the side face of an element mounting substrate such as a submount, and to provide its convenient fabrication process. SOLUTION: The semiconductor laser device comprises an element mounting substrate 2, and a semiconductor laser element 1 bonded onto the element mounting substrate through a solder layer 3 wherein the light emitting surface of the semiconductor laser element 1 is flush with the upper surface of the element mounting substrate at the front end thereof and the lower surface of the element mounting substrate at the front end thereof is projecting from the upper surface of the element mounting substrate at the front end thereof in the traveling direction of laser beam. A bevel is formed at least partially on the front side face of the element mounting substrate from the front end of the upper surface of the element mounting substrate toward the front end of the lower surface and a metallization layer is formed on the bevel of the front side face of the element mounting substrate. COPYRIGHT: (C)2006,JPO&NCIPI
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