发明名称 |
FACE TO FACE BONDED I/O CIRCUIT DIE AND FUNCTIONAL LOGIC CIRCUIT DIE SYSTEM |
摘要 |
An integrated circuit system includes a first set of integrated circuit dice each member of the set having a different configuration of input/output circuits disposed thereon and a second set of integrated circuit dice each having different logical function circuits disposed thereon. Each member of the first and second sets of integrated circuit dice include an array of face-to-face bonding pads disposed thereon that mate with the array of face-toface bonding pads of each member of the other set. |
申请公布号 |
WO2006039254(A3) |
申请公布日期 |
2006.07.13 |
申请号 |
WO2005US34526 |
申请日期 |
2005.09.26 |
申请人 |
ACTEL CORPORATION;SPEERS, THEODORE |
发明人 |
SPEERS, THEODORE |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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