发明名称 |
TILE-BASED ROUTING METHOD OF A MULTI-LAYER CIRCUIT BOARD AND RELATED STRUCTURE |
摘要 |
A method for routing a plurality of signal traces out of a plurality of corresponding bumper pads for implementation of a die on a multi-layer circuit board includes utilizing the plurality of bumper pads positioned in a periphery area of the die; utilizing a plurality of power/ground bumper pads positioned in a center area of the die; assigning a plurality of signal traces corresponding to a plurality of bumper pads as a plurality of first-layer traces being routed in a first layer of the multi-layer circuit board; assigning a plurality of signal traces corresponding to a plurality of bumper pads as a plurality of second-layer traces being routed in a second layer of the multi-layer circuit board; routing the plurality of first-layer traces straight away from the die; and routing the plurality of second-layer traces with a turn not to be vertically underneath the first-layer traces. |
申请公布号 |
US2006154402(A1) |
申请公布日期 |
2006.07.13 |
申请号 |
US20060277042 |
申请日期 |
2006.03.21 |
申请人 |
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发明人 |
FANG CHUNG-YI;CHAO TZE-HSIANG;SU YI-SHOW |
分类号 |
H01L21/50;G06F17/50;H01L23/498;H01L23/50;H01L23/552;H05K1/02;H05K1/11 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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