| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make electronic equipment thin, without depending on making electronic components small-sized or thin. <P>SOLUTION: The electronic equipment comprises a housing 2 constituted by combining two case members 17 and 19 to each other along the thicknesses, a circuit board 21 arranged between the two case members 17 and 19, the electronic component 13, which is arranged without overlapping the circuit board 21 along the thickness and electrically connected to the circuit board 21, a holding portion 25 which is formed in the case member 17 and houses the electronic component 13, and a projection portion 33 which projects from an internal surface 19a of the case member 19 facing the circuit board 21 to the case member 17, the electronic component 13 being pressed by the projection portion 33 from the side of the case member 19 to the side of the case member 17, in a state with the case members 17 and 19 being combined. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
