发明名称 SUBSTRATE RECOGNITION PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide the optimizing method of luminance obtained by the irradiation of light through an illumination device in accordance with the kind of a printed circuit board. <P>SOLUTION: The recognition processing of an image photographed by a substrate recognition camera 2 under a condition that a coaxial illuminating device 6 and a first ring illuminating device 8 are illuminating so as to obtain a predetermined brightness based on reference luminance data, is effected by a substrate recognition processing device 22. When the recognition processing is abnormal, illumination, imaging and recognition processing are effected based on a plurality of first luminance data increased or decreased from the reference luminance data with a predetermined first increasing and decreasing rate. Then the recognition processing results of each plurality of first luminance data are weighted to effect illumination, imaging and recognition processing based on a plurality of second luminance data increased with a second increasing and decreasing rate smaller than the first increasing and decreasing rate about the center of the first best luminance data selected from the weighted results. Thereafter, the recognition processing results of each plurality of second luminance data are weighted to effect the recognition processing of the succeeding printed circuit boards based on the second best luminance data selected from the weighted results. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006186076(A) 申请公布日期 2006.07.13
申请号 JP20040377400 申请日期 2004.12.27
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 IKEDA YOSHIAKI;WADA TOSHIAKI;ONO TETSUJI
分类号 H05K13/08 主分类号 H05K13/08
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