发明名称 MANUFACTURING METHOD OF WIRING SUBSTRATE AND ELECTRO-OPTICAL DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring substrate which can so form conductive patterns efficiently that they intersect mutually and can lower its manufacturing cost, and to provide the manufacturing method of an electro-optical device. SOLUTION: The manufacturing method of a wiring substrate which includes processes for forming on the single substrate a plurality of conductive patterns intersecting mutually has a process for forming a conductive pattern 13 of the plurality of conductive patterns, a process for forming the other two conductive patterns 11 of the plurality of conductive patterns which are so disposed as to be separated from the conductive pattern 13 and as to sandwich the conductive pattern 13 between them, a process for coating with an insulating material at least a portion of the conductive pattern 13 which is sandwiched by the other two conductive patterns 11, and a process for connecting electrically the other two conductive patterns 11 with each other by electroless-plated metals formed on the place coated with the insulating material. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006186154(A) 申请公布日期 2006.07.13
申请号 JP20040379200 申请日期 2004.12.28
申请人 SEIKO EPSON CORP 发明人 KOEDA SHUJI
分类号 H01L21/3205;H01L21/288;H01L29/786;H01L51/50;H05B33/10;H05B33/26 主分类号 H01L21/3205
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