Device for storing and/or transporting plate-shaped substrates in the manufacture of electronic components

摘要

To make possible a tightly packed, essentially horizontal storage of wafers ( 40 ), in which a simplified access to each of these wafers ( 40 ) is possible, a device is provided having a plurality of superimposed storage elements ( 10 ). The storage elements ( 10 ) have device features ( 16 ) for depositing the wafers ( 40 ). The storage elements ( 10 ) have projections ( 14 ) for lifting, whereby a specific storage element ( 10 a) as well as all storage elements ( 10 ) arranged above this specific storage element ( 10 a) can be lifted by a predetermined first height for producing a contact gap. The projections ( 14 ) can also be used to lift the storage element ( 10 b) arranged below the said storage element ( 10 a) by a predetermined second height for producing a freedom of access.