SEMICONDUCTOR AMPLIFIER

摘要

A via hole (21) whose one end is grounded is provided in the vicinity of a connecting end part of at least an input matching circuit board (17) or an output matching circuit board (18) with a transistor chip (10). On the other end side of the via hole (21), a source grounding structure of the transistor chip (10) is provided by electrical connection by wire bonding from a source pad (4) of the transistor chip (10).