METHOD FOR PROVIDING DOUBLE-SIDED COOLING OF LEADFRAME-BASED WIRE-BONDED ELECTRONIC PACKAGES AND DEVICE PRODUCED THEREBY

摘要

A method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages. The method includes the steps of: positioning a plurality of heatslug members ( 140 ) over a corresponding plurality of electronic packages ( 100 ') formed on a leadframe strip ( 142 ), wherein each of the heatslug members includes a heatslug ( 130 ) and a plurality of legs ( 144 ) for supporting the heatslug over a respective one of the electronic packages; introducing a molding compound ( 132 ) between each heatslug member and its respective electronic package; curing the molding compound; and cutting the heatslug members and separating the electronic packages ( 100 ) from the leadframe strip, such that each electronic package includes a heatslug for cooling a first side of the electronic package.