发明名称 |
Flip-chip bonding structure using multi chip module-deposited substrate |
摘要 |
Flip-chip bonding structures using an MCM-D substrate are disclosed. A flip-chip bonding structure using an MCM-D substrate includes: a silicon substrate, a Si-bump disposed at a predetermined position of the silicon substrate, wherein a material of the Si-bump is the same as the silicon substrate, a dielectric layer disposed on the silicon substrate and a transmission line formed on the Si-bump to connect to a circuit formed on the dielectric layer. |
申请公布号 |
KR20060081105(A) |
申请公布日期 |
2006.07.12 |
申请号 |
KR20050001536 |
申请日期 |
2005.01.07 |
申请人 |
SEOUL NATIONAL UNIVERSITY INDUSTRY FOUNDATION |
发明人 |
SEO, KWANG SEOK;SONG, SANG SUB |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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