发明名称 Power semiconductor device
摘要 A power semiconductor device includes a first semiconductor layer of non-doped Al<SUB>X</SUB>Ga<SUB>1-X</SUB>N (0<=X<=1), and a second semiconductor layer of non-doped or n-type Al<SUB>Y</SUB>Ga<SUB>1-Y</SUB>N (0<=Y<=1, X<Y) disposed on the first semiconductor layer. Source and drain electrodes are disposed separately from each other, and electrically connected to the second semiconductor layer. A gate electrode is disposed on the second semiconductor layer between the source and drain electrodes. An insulating film covers the second semiconductor layer between the gate and drain electrodes. A first field plate electrode is disposed on the insulating film and electrically connected to the gate electrode. A second field plate electrode is disposed on the insulating film and electrically connected to the source electrode.
申请公布号 US7075125(B2) 申请公布日期 2006.07.11
申请号 US20040806397 申请日期 2004.03.23
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 SAITO WATARU;OMURA ICHIRO
分类号 H01L31/0328;H01L21/338;H01L29/06;H01L29/20;H01L29/40;H01L29/417;H01L29/778;H01L29/812 主分类号 H01L31/0328
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