发明名称 |
Semiconductor devices and methods of fabricating the same |
摘要 |
A semiconductor device comprises a device isolation layer disposed in a portion of a substrate of first conductivity type. An outline of the device isolation layer defines an active region of the substrate. An impurity diffused region of second conductivity type may be formed in a portion of the active region; and a silicide layer may be formed to cover the impurity diffused region of second conductivity type. The device isolation layer may include a recess formed therein to expose a portion of the substrate of first conductivity type adjacent to the impurity diffused region of second conductivity type. The silicide layer that is formed to cover the impurity diffused layer of second conductivity type may extend over and against the exposed region of the substrate of first conductivity type that was exposed by the recess of the device isolation layer.
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申请公布号 |
US7074683(B2) |
申请公布日期 |
2006.07.11 |
申请号 |
US20040796754 |
申请日期 |
2004.03.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG SUN-HA;KIM YOUNG-OK;YEO CHA-DONG |
分类号 |
H01L21/28;H01L21/336;H01L21/76;H01L21/8234;H01L21/8238;H01L27/08;H01L27/088;H01L27/092;H01L29/78 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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