| 发明名称 |
Method and apparatus for applying body bias to integrated circuit die |
| 摘要 |
In some embodiments, a method includes providing an integrated circuit (IC) die in a package. The IC die may have a metal layer on a back surface of the IC die. The method may also include applying a bias signal to the IC die via the metal layer.
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| 申请公布号 |
US7075180(B2) |
申请公布日期 |
2006.07.11 |
| 申请号 |
US20030747805 |
申请日期 |
2003.12.29 |
| 申请人 |
INTEL CORPORATION |
发明人 |
NARENDRA SIVA G.;TSCHANZ JAMES W.;ZIA VICTOR;KOMMANDUR BADARINATH;DE VIVEK K. |
| 分类号 |
H01L23/10;H01L21/60;H01L23/34;H01L23/367;H01L23/50 |
主分类号 |
H01L23/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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