摘要 |
A contact-making apparatus for making contact with circuit units to be tested in a tester contains a printed circuit board device that has electrical connections to the tester, and a test module device. The test module device has first contact-making elements for making electrical contact between the test module device and the printed circuit board device, and second contact-making elements for making electrical contact between the test module device and the circuit unit to be tested. When the printed circuit board device and the circuit unit to be tested are pressed onto each other, a spring force of the first contact-making elements is lower than the spring force of the second contact-making elements under a low initial compression, and a spring force of the first contact-making elements are higher than the spring force of the second contact-making elements under a high final compression.
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