发明名称 |
Semiconductor packaging techniques for use with non-ceramic packages |
摘要 |
A method for attaching at least one IC die to a non-ceramic IC package including a leadframe and a base, the IC package being configured for receiving the at least one IC die, includes attaching the IC die to an upper surface of a thermal carrier in a manner which facilitates thermal transfer between the die and the carrier. The method further includes attaching the thermal carrier having the IC die attached thereto to an upper surface of the base of the IC package. In this manner, one or more IC dies may be attached to a standard plastic IC package without a significant impact on thermal transfer in the device and at a significant cost savings compared to ceramic IC packages.
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申请公布号 |
US7075174(B2) |
申请公布日期 |
2006.07.11 |
申请号 |
US20040788162 |
申请日期 |
2004.02.26 |
申请人 |
AGERE SYSTEMS INC. |
发明人 |
BRENNAN JOHN MCKENNA;FREUND JOSEPH MICHAEL;MILLER CURTIS JAMES;SHANAMAN, III RICHARD HANDLY |
分类号 |
H01L23/495;H01L21/44;H01L21/48;H01L21/50;H01L23/047;H01L23/31;H01L23/433 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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