| 摘要 |
An apparatus determines how well a semiconductor wafer ( 4 ) is clamped to a support member ( 1 ). The apparatus has at least one ultrasonic transducer ( 2 a, 2 b, 2 c, 2 d) configured to emit ultrasonic energy ( 3 ) toward an interface between the water ( 4 ) and the support member ( 1 ) so that the interface generates echo signals, and a data processing unit ( 11 ) configured to analyze the echo signals to arrive at a determination as to how well the semiconductor wafer ( 4 ) is clamped to the support member ( 1 before semiconductor process is started. A first method ensures that a wafer ( 4 ) is securely clamped to a support member before a semiconductor process is started. A second method verifies proper de-clamping of a semiconductor wafer ( 4 ) from a support member ( 1 ) before the semiconductor wafer ( 4 ) is removed from the support member ( 1 ) upon completion of a semiconductor process.
|
