| 摘要 |
A method for fabricating a photomask for an integrated circuit. The method includes, for example, providing a substrate with at least one trench, providing a prepatterned surface at the bottom of the trench, and providing a multilayer coating over the substrate. As a result, the multilayer coating forms a reflection region on the surface of the substrate outside the trench and a non-reflection region in the trench. The invention additionally provides a corresponding photomask.
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