发明名称 |
SEMICONDUCTOR PACKAGE INCREASING EFFICIENCY OF HEAT EMISSION AND METHOD OF FABRICATING THE SAME |
摘要 |
A semiconductor package comprising a semiconductor chip and a first heat spreader adhered to the upper surface of the semiconductor chip is provided. The first heat spreader comprises a flat metal plate and a plurality of metal balls adhered to the flat metal plate. A method of fabricating the semiconductor chip package is also provided. |
申请公布号 |
KR20060080420(A) |
申请公布日期 |
2006.07.10 |
申请号 |
KR20050000805 |
申请日期 |
2005.01.05 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, SANG UK;IM, YUN HYEOK |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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