| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors capable of obtaining superior filling property even in the case of increasing the amount of an inorganic filler and capable of reducing a package crack. SOLUTION: The epoxy resin composition for sealing semiconductors contains an epoxy resin, a curing agent, a cure-accelerator, and the inorganic filler, and it contains a bisphenol A-type epoxy resin as the epoxy resin component and a phenol resin having a structure shown by formula (1) in which m shows an integer of 1-3, and n shows an integer of 1-10, as the curing agent component. COPYRIGHT: (C)2006,JPO&NCIPI
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