发明名称 CURABLE COMPOSITION
摘要 <p>A curable composition, which comprises: (A) an organic polymer having a reactive silicon-containing group, (B) a carboxylic acid and/or a metal salt of a carboxylic acid, (C) an amine compound having no reactive silicon group, (D) a silane compound substituted with an amino group and (E) a silane compound substituted with an epoxy group, wherein the composition has a ratio of the molar number (d) of the total amino groups of the silane compound substituted with an amino group (D) to the molar number (e) of the total epoxy groups of the silane compound substituted with an epoxy group (E), that is, (d)/(e) of 1 or more, and has a total amount of (D) component and (E) component of 30 mmol or more relative to 100 g of (A) component. The above curable composition is a curable composition comprising an organic polymer having a silicon-containing group and being crosslinkable through the formation of a siloxane bonding, which uses a curing catalyst free of an organotin compound and exhibits good adhesiveness and also stable curability even after it is stored.</p>
申请公布号 WO2006070637(A1) 申请公布日期 2006.07.06
申请号 WO2005JP23323 申请日期 2005.12.20
申请人 KANEKA CORPORATION;YANO, AYAKO;OKAMOTO, TOSHIHIKO 发明人 YANO, AYAKO;OKAMOTO, TOSHIHIKO
分类号 C08L101/10;C08K5/00 主分类号 C08L101/10
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