发明名称 THERMALLY CONDUCTIVE ACRYLIC RESIN COMPOSITION AND HEAT CONDUCTIVE SHEET-LIKE MOLDINGS USING IT
摘要 PROBLEM TO BE SOLVED: To provide a thermally conductive acrylic resin composition making possible to contain a thermally conductive filler in a high ratio, to attain superior flame resistance and heat conductivity, further enabling to improve processing aptitude by keeping viscosity low and to provide a thermally conductive resin sheet shape moldings using it. SOLUTION: The thermally conductive acrylic resin composition comprises an acrylic copolymer with a carboxy group as a functional group and a compound having at least two glycidyl groups as a functional group in the molecule as a matrix and contains to 100 pts.mass of the acrylic copolymer a metal hydroxide powder of 100-500 pts.mass as a heat conducting filler and also a wetting dispersant of 0.05-3 pts.mass. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006176723(A) 申请公布日期 2006.07.06
申请号 JP20040373685 申请日期 2004.12.24
申请人 ACHILLES CORP 发明人 TAKANO TADAHIRO;SUZUKI TAKURO;UBUKATA MAMORU
分类号 C08G59/42;C08K3/20;C08L63/00;H01L23/36;H01L23/373 主分类号 C08G59/42
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