发明名称 |
Non-via method of connecting magnetoelectric elements with conductive line |
摘要 |
A non-via method of connecting a magnetoelectric element with a conductive line. A magnetoelectric element is formed on a substrate, and spacers are formed on side walls of the magnetoelectric element. A dielectric layer is deposited over the substrate and magnetoelectric element and planarized to a level above the magnetoelectric element. The dielectric layer is etched to expose the upper surface of the magnetoelectric element, and a conductive line is formed on the magnetoelectric element.
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申请公布号 |
US2006148234(A1) |
申请公布日期 |
2006.07.06 |
申请号 |
US20050154632 |
申请日期 |
2005.06.17 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
CHEN YOUNG-SHYING;HSU HONG-HUI;CHEN WEI-CHUAN;CHUANG CHUN-FEI;KAO MING-JER |
分类号 |
H01L21/00;H01L21/4763 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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