发明名称 Non-via method of connecting magnetoelectric elements with conductive line
摘要 A non-via method of connecting a magnetoelectric element with a conductive line. A magnetoelectric element is formed on a substrate, and spacers are formed on side walls of the magnetoelectric element. A dielectric layer is deposited over the substrate and magnetoelectric element and planarized to a level above the magnetoelectric element. The dielectric layer is etched to expose the upper surface of the magnetoelectric element, and a conductive line is formed on the magnetoelectric element.
申请公布号 US2006148234(A1) 申请公布日期 2006.07.06
申请号 US20050154632 申请日期 2005.06.17
申请人 INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE 发明人 CHEN YOUNG-SHYING;HSU HONG-HUI;CHEN WEI-CHUAN;CHUANG CHUN-FEI;KAO MING-JER
分类号 H01L21/00;H01L21/4763 主分类号 H01L21/00
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