| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component while sucking it without causing any damage. <P>SOLUTION: When an IC chip arranged on a supply member is mounted on a printed board while being sucked and held, air is blown to the outer circumferential edge thereof from an air blow-off hole 11 opening to a cylindrical space chamber 4 provided at a lower section of a suction nozzle 1 in order to float the IC chip W above the supply member and to hold it in noncontact state for the suction nozzle 1. Subsequently, air is sucked from an air suction hole 12 opening to the cylindrical space chamber 4 of the suction nozzle 1 thus sucking the floating IC chip W to the lower end face of the suction nozzle 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
