| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure for a semiconductor device capable of being manufactured at a relatively low cost, of maintaining power balance between semiconductor elements, and of reducing noise and surge caused by a substrate wiring. SOLUTION: A first element sticking part 11 is disposed between a second element sticking part 12 and a third element sticking part 13, and is integral with the second element sticking part 12 at the bottom end via lower part coupling parts 15a, 15b. The third element sticking part 13 is formed in parallel with the second element sticking part 12 with the first element sticking part 11, and is integral with the second element sticking part 12 at top end thereof via an upper part coupling part 16. The entire shape of an entire heat dissipation body 10 is spiral, and the first element sticking part 11 is formed to be contained in the innermost part thereof. In addition, these element sticking parts are equidistantly formed. COPYRIGHT: (C)2006,JPO&NCIPI |
