发明名称 METHOD FOR FORMING SOLDER LAYER
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a solder layer having a predetermined thickness easily and efficiently. SOLUTION: When a solder layer is formed on the surface of an electrode 42, a predetermined quantity of molten solder is supplied onto the surface of the electrode 42 at a distance D1 therefrom. Consequently, a solder layer is formed on the surface of the electrode 42. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006179534(A) 申请公布日期 2006.07.06
申请号 JP20040368437 申请日期 2004.12.20
申请人 TDK CORP 发明人 SHIRAKAWA YUKIHIKO;OTAKI SHUNICHI;TAKESHIMA TSUTOMU
分类号 H05K3/34;B23K3/06;B23K101/42 主分类号 H05K3/34
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