POLYAMIC ACID, POLYIMIDE FILM MADE THEREFROM, ITS PRODUCTION METHOD AND FLEXIBLE CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a polyimide film which exhibits a high peel strength when it is press-bonded with a metal foil through an adhesive, a method for easily producing the film and a circuit board using the film. SOLUTION: A polyamic acid is synthesized from an aromatic diamine containing 0.1-100 mol% carboxy-4,4'-diaminodiphenylmethane and an aromatic tetracarboxylic dianhydride or its derivative. The polyimide film obtained by thermally and/or chemically imidating the polyamic acid exhibits a high peel strength when it is press-bonded with the metal foil through the adhesive. COPYRIGHT: (C)2006,JPO&NCIPI