| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which ensures a wide range of effective area and forms conductor wirings by a method of simplifying the cleaning process. SOLUTION: The method comprises a step of forming conductor wiring in wiring trenches or connection holes formed in an insulation film on a semiconductor substrate. This step of forming the conductor wiring comprises a step of forming a conductor seed film in only the effective area of the semiconductor substrate on the semiconductor substrate, and a step of forming a conductor plating film by the electrolytic plating method on the conductor seed film. COPYRIGHT: (C)2006,JPO&NCIPI
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