发明名称 Curable composition, underfill, and method
摘要 A curable composition is provided, and a method associated therewith. The curable composition may include a curable resin and a finely divided refractory solid. The solid may have a surface area that is greater than about 5 square meters per gram, and a determined density of active surface termination sites per square nanometer of surface area.
申请公布号 US2006147719(A1) 申请公布日期 2006.07.06
申请号 US20060368146 申请日期 2006.03.03
申请人 发明人 RUBINSZTAJN SLAWOMIR;CAMPBELL JOHN R.;MILLS RYAN C.;PRABHAKUMAR ANANTH;TANOPI SANDEEP S.;GIBSON DAVID A.III;SCHATTENMANN FLORIAN J.
分类号 B32B27/38;B32B15/02;C08K3/22 主分类号 B32B27/38
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