<p>Spectral imaging systems and methods are provided for monitoring a substrate during a chemical-mechanical planarization process. An example system includes a carrier configured to receive a substrate, and a platen configured to receive a polishing pad. The platen includes an aperture configured to pass light. The system also includes a frame that disposes the platen in any number of positions relative to the carrier. An optoelectronic system is coupled to the aperture, and the aperture passes light of the optoelectronic system to illuminate the substrate and passes reflected light from the substrate to the optoelectronic system. A processing system is coupled to the optoelectronic system and uses the reflected light to image the substrate as the polishing pad is polishing the substrate.</p>
申请公布号
WO2006071651(A2)
申请公布日期
2006.07.06
申请号
WO2005US46211
申请日期
2005.12.21
申请人
FILMETRICS, INC.;CHALMERS, SCOTT, A.;GEELS, RANDALL, S.;BIBBY, THOMAS, F., A.
发明人
CHALMERS, SCOTT, A.;GEELS, RANDALL, S.;BIBBY, THOMAS, F., A.