| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit device high in the reliability of resin sealing and its manufacturing method. <P>SOLUTION: One surface of an insulating resin film 2 is provided with a semiconductor chip 1 and the other surface of the insulating resin film 2 is provided with a conductive layer 3 electrically connected to the semiconductor chip 1. The conductive layer 3 is provided with a solder ball (electrode) 4 for connecting the same to the circuit substrate 5 and, further, an insulating resin layer 6 is provided between the conductive layer 3 and the circuit substrate 5 so as to bury the electrode 4 whereby the circuit device 100a is constituted. In this case, the side surface of the semiconductor chip 1 is covered by the insulating resin film 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
