| 摘要 |
Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip ( 1 ), which is disposed in a recess ( 2 ) of a housing base body ( 3 ) and is there encapsulated with an encapsulant ( 4 ) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip ( 1 ). The recess ( 2 ) comprises a chip well ( 21 ) in which the semiconductor chip ( 1 ) is secured, and a trench ( 22 ) that runs at least partway around the chip well ( 21 ) inside the recess ( 2 ), such that between the chip well ( 21 ) and the trench ( 22 ) the housing base body ( 3 ) comprises a wall ( 23 ) whose apex, viewed from a bottom face of the chip well ( 21 ), lies below the level of the surface of the housing base body ( 3 ) from which the recess ( 2 ) leads into the housing base body ( 3 ), and the encapsulant ( 4 ) extends outward from the chip well ( 21 ) over the wall into the trench ( 22 ). A corresponding housing base body is also disclosed.
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