HIGHLY HEAT CONDUCTIVE CIRCUIT MODULE MANUFACTURING METHOD AND HIGHLY HEAT CONDUCTIVE CIRCUIT MODULE

摘要

A method for efficiently manufacturing a circuit module which highly dissipates heat generated by an electronic component at a low cost and a circuit module whereupon the electronic component can be accurately mounted. Metal layers having a high heat conductivity and an insulating resin layer are laminated to form a laminated body wherein the metal layers are bonded and integrated by an insulating resin, and a plurality of packages are cut from the integrated laminated body. Each package is composed of metal bases and an insulating spacer which electrically separates the metal bases and mechanically combines them. The metal base is formed of a part of the metal layer, the insulating spacer is formed of a part of the insulating resin layer, the electronic component provided with at least two terminals are arranged on the package, and each terminal is electrically connected with the metal base separated by the insulating spacer.