| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a package structure where mounting resistance can be reduced. <P>SOLUTION: First metal members (lead terminals 5 and 6) are connected to a first electrode (source electrode 2) of a semiconductor element (semiconductor chip 1) through first metal objects (Au bumps 8) comprising a first noble metal. A second metal member (die terminal 7) is connected to a second electrode (back electrode 4) through second metal objects (noble metal plating 14 and Ag plating 15) comprising a second noble metal. The members are connected to the back electrode, and a mounting face of the semiconductor device with a wiring board is a circuit forming face-side. The metal member is bent. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
