| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a heat transfer coefficient of a boiling cooler device for cooling a heat generating body such as a semiconductor element by latent heat transfer by boiling and condensing of a refrigerant. <P>SOLUTION: The boiling cooler device is provided with a refrigerant tank 1 having a wick 13 therein so as to store a liquid phase refrigerant, and the heat generation body 90 attached on an outer surface; and a heat radiating part 2 for cooling the refrigerant boiled by the heat of the heat generation body 90 and returning it to the refrigerant tank 1 after condensing. The wick 13 comprises an open cell foam metallic body having a pore diameter of 100 μm or less, and a void rate of 80% or more. The pore diameter is 100 μm or less, and thereby nucleate boiling in the wick is promoted, and the void rate is 80% or more, and thereby vapor can easily escape, and therefore, heat resistance is reduced, and the heat transfer coefficient of the boiling cooler device is improved. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
