发明名称 ADHESIVE COMPOSITION FOR ELECTRONIC EQUIPMENT, ADHESIVE SHEET FOR ELECTRONIC EQUIPMENT, AND ELECTRONIC PART AND ELECTRONIC EQUIPMENT USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an adhesive composition for electronic equipment, having excellent adhesive force, excellent reflow resistance and quick curability, to provide an adhesive sheet for electronic equipment, and to provide an electronic part and electronic equipment each using the same. <P>SOLUTION: This adhesive composition for the electronic equipment comprises a thermoplastic resin, an epoxy resin, an inorganic filler, and an imidazole compound represented by the general formula (I). <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006176764(A) 申请公布日期 2006.07.06
申请号 JP20050338296 申请日期 2005.11.24
申请人 TORAY IND INC 发明人 NISHIOKA DAIKICHI;SAWAMURA TAIJI;SHINOHARA HIDEKI
分类号 C09J163/00;C09J7/02;C09J11/04;C09J11/06;C09J201/00;H01L21/52;H01L21/60;H01L23/40;H05K3/46 主分类号 C09J163/00
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