摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive composition for electronic equipment, having excellent adhesive force, excellent reflow resistance and quick curability, to provide an adhesive sheet for electronic equipment, and to provide an electronic part and electronic equipment each using the same. <P>SOLUTION: This adhesive composition for the electronic equipment comprises a thermoplastic resin, an epoxy resin, an inorganic filler, and an imidazole compound represented by the general formula (I). <P>COPYRIGHT: (C)2006,JPO&NCIPI |