| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the reliability of an electric connection between a semiconductor package and a circuit board in a lead frame used for the semiconductor package comprising a semiconductor chip. <P>SOLUTION: This lead frame consists of a metal thin plate having a stage portion 5 on which the semiconductor chip 3 is disposed, a plurality of leads 7 provided around it, and a connector 9 for connecting these leads 7. In the lead frame, recesses 13 are recessed from and formed in one end surface 7a of the lead 7 in the thickness direction of the lead frame. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
