Light emitting diode package and process of making the same

摘要

A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.